Camp Russo Homelab

View on GitHub

← Back to Main Homelab Hub

unRAID Storage Server

Running unRAID serving as a storage server for the homelab. In an emergency, it can host Docker and VMs.

Preview Product Name Component Specifications & Notes
Chassis Rosewill 4U Server Chassis 9 Bay Server Case Standard 4U rackmount enclosure
Provides 9 internal/external expansion bays for high-density storage layout
Motherboard ASRock Rack Motherboard E3C236D4U Enterprise Micro-ATX server board (Intel C236 chipset)
Features dual Gigabit LAN ports and native IPMI management
CPU Intel Xeon E3-1270 v6 Quad-core Processor 4 Cores / 8 Threads, 3.80 GHz base clock (Kaby Lake)
Reliable computing power with integrated Intel HD Graphics P630
RAM Samsung 16GB 2X8GB PC4-2133P DDR4 ECC UDIMM 2133MHz unbuffered enterprise server memory
ECC error-correcting capabilities ensures high system uptime and data integrity
NVMe Toshiba XG6 KXG60ZNV512G 512GB NVMe M.2 SSD High-speed M.2 2280 form-factor solid state drive
Serves as an ideal lightning-fast application host or cache drive
SATA SSD Samsung SSD 860 EVO 4TB 2.5 Inch SATA III SSD High-capacity 2.5” high-endurance flash storage
Massive 4TB solid-state block for heavy read/write container or VM workloads
PSU CORSAIR RM550x 550 Watt 80+ Gold Fully Modular PSU Premium efficiency compact ATX power supply unit
Fully modular cables ensure clean airflow optimization throughout the 4U chassis
Fan Noctua NF-P12 redux-1300 PWM 120mm 4-Pin Fan High-pressure pressure-optimized quiet cooling unit
Note: System utilizes custom configurations/wrappers to support legacy 3-pin chassis requirements
NIC Mellanox MNPA19-XTR 10G Connectx-2 PCIe SFP+ NIC Enterprise PCI Express 10 Gigabit SFP+ fiber network adapter
Establishes ultra-fast 10GbE network fabric backend uplink to main switch
Cable H!Fiber.com 2 Pack 10G SFP+ DAC Cable 2M Twinax passive network patch link assemblies
One for unRAID server and one for storage server
Thermal Compound Thermal Grizzly Conductonaut Thermal Grease Liquid metal high-performance thermal interface compound
Maximizes heat dissipation between Xeon IHS and cooling arrays